Contact Pressure Distribution During the Polishing Process of Ceramic Tiles: A Laboratory Investigation

A. S. A., Sani and F. J. P., Sousa and Zamzuri, Hamedon and Azmir, Azhari (2016) Contact Pressure Distribution During the Polishing Process of Ceramic Tiles: A Laboratory Investigation. In: IOP Conference Series: Materials Science and Engineering: 2nd International Manufacturing Engineering Conference and 3rd Asia-Pacific Conference on Manufacturing Systems (iMEC-APCOMS 2015), 12–14 November 2015 , Kuala Lumpur, Malaysia. pp. 1-19., 114 (012008). ISSN 1757-8981 (Print), 1757-899X (Online)

[img]
Preview
PDF
fkp-2016-asas-contact pressure distribution during the polishing.pdf
Available under License Creative Commons Attribution.

Download (1MB) | Preview

Abstract

During the polishing process of porcelain tiles the difference in scratching speed between innermost and peripheral abrasives leads to pressure gradients linearly distributed along the radial direction of the abrasive tool. The aim of this paper is to investigate such pressure gradient in laboratory scale. For this purpose polishing tests were performed on ceramic tiles according to the industrial practices using a custom-made CNC tribometer. Gradual wear on both abrasives and machined surface of the floor tile were measured. The experimental results suggested that the pressure gradient tends to cause an inclination of the abraded surfaces, which becomes stable after a given polishing period. In addition to the wear depth of the machined surface, the highest value of gloss and finest surface finish were observed at the lowest point of the worn out surface of the ceramic floor tile corresponding to the point of highest pressure and lowest scratching speed.

Item Type: Conference or Workshop Item (Lecture)
Uncontrolled Keywords: polishing process; pressure gradient
Subjects: T Technology > TS Manufactures
Faculty/Division: Faculty of Manufacturing Engineering
Depositing User: Mrs. Neng Sury Sulaiman
Date Deposited: 02 Nov 2016 06:42
Last Modified: 27 Feb 2018 01:18
URI: http://umpir.ump.edu.my/id/eprint/14756
Download Statistic: View Download Statistics

Actions (login required)

View Item View Item