Out-of-plane Characterization of Silicon-on-insulator Multiuser MEMS Processes-based Tri-axis Accelerometer

L., Sujatha and S., Kalaiselvi and Vigneswaran, Narayanamurthy (2016) Out-of-plane Characterization of Silicon-on-insulator Multiuser MEMS Processes-based Tri-axis Accelerometer. Sensors & Transducers, 205 (10). pp. 63-71. ISSN 2306-8515 (print); 1726-5479 (online). (Published)

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In this paper, we discuss the analysis of out-of-plane characterization of a capacitive tri-axis accelerometer fabricated using SOI MUMPS (Silicon-on Insulator Multi user MEMS Processes) process flow and the results are compared with simulated results. The device is designed with wide operational 3 dB bandwidth suitable for measuring vibrations in industrial applications. The wide operating range is obtained by optimizing serpentine flexures at the four corners of the proof mass. The accelerometer structure was simulated using COMSOL Multiphysics and the displacement sensitivity was observed as 1.2978 nm/g along z-axis. The simulated resonant frequency of the device was found to be 13 kHz along z axis. The dynamic characterization of the fabricated tri-axis accelerometer produces the out-of-plane vibration mode frequency as 13 kHz which is same as the simulated result obtained in z-axis.

Item Type: Article
Uncontrolled Keywords: Tri-Axis accelerometer, SOIMUMPS, High bandwidth, Vibration measurement, Resonant frequency
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty/Division: Faculty of Electrical & Electronic Engineering
Depositing User: Noorul Farina Arifin
Date Deposited: 01 Mar 2017 06:46
Last Modified: 01 Mar 2017 06:46
URI: http://umpir.ump.edu.my/id/eprint/16924
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