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Measurement of contact angle of silicone glue droplet on Cu surface in MEMS Microphone Package

Farah Nadia, Mahfudz (2017) Measurement of contact angle of silicone glue droplet on Cu surface in MEMS Microphone Package. Faculty of Manufacturing Engineering, Universiti Malaysia Pahang.

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Abstract

This project is studying on the contact angle (CA) Measurement on the Copper (Cu) surface in MEMS Microphone Package. The CA measurement is of great importance to estimate the wettability of the Silicon glue on the Cu surface as it can affect the adhesiveness performance of the Silicon glue during the die attach process. Hence, this fundamental study is aimed to investigate the effects of surface cleaning materials on the Cu substrate, different drop volume and time deposition of the Silicon glue to the CA measurement and to analyze the CA using image analysis method by Adobe Photoshop and ImageJ. As a result, it is found that the CA become lower by cleaning using the Acetone and Ethanol. This can be attributed by the facts that cleaning is a method to remove the organic impurities. Moreover, the smaller droplet volume was found to decrease the CA. Besides, the longer the time deposition can reduce CA. This is because of the wetting process occurred once the droplet is dispensed. Furthermore, overall results of CA using Adobe Photoshop is found to be more accurate compared to ImageJ.

Item Type: Undergraduates Project Papers
Additional Information: Project Paper (Bachelor of Engineering in Manufacturing Engineering) -- Universiti Malaysia Pahang – 2017, SV: DR. NURRINA BINTI ROSLI, NO. CD: 11818
Uncontrolled Keywords: Contact angle (CA); silicone glue; Cu surface
Subjects: T Technology > TS Manufactures
Faculty/Division: Faculty of Manufacturing Engineering
Depositing User: Mrs. Sufarini Mohd Sudin
Date Deposited: 28 Aug 2019 04:46
Last Modified: 28 Aug 2019 04:46
URI: http://umpir.ump.edu.my/id/eprint/25750
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