Asyraf, Abdullah and Siti Rabiatull Aisha, Idris (2023) A review: effect of copper percentage solder alloy after laser soldering. Soldering & Surface Mount Technology, ahead-of-print (ahead-of-print). pp. 1-29. ISSN 0954-0911. (Published)
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Abstract
Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Powder metallurgy, solder alloy, laser soldering, intermetallic compound, solder joint strength |
| Subjects: | T Technology > TS Manufactures |
| Faculty/Division: | Institute of Postgraduate Studies Faculty of Mechanical and Automotive Engineering Technology |
| Depositing User: | Noorul Farina Arifin |
| Date Deposited: | 12 Apr 2023 08:45 |
| Last Modified: | 12 Apr 2023 08:45 |
| URI: | http://umpir.ump.edu.my/id/eprint/37468 |
| Download Statistic: | View Download Statistics |
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