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Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partial-filling Ultraviolet Nanoimprint Lithography

Nurhafizah, Abu Talip and Hayashi, Tatsuya and Tanighuchi, Jun and Hiwasa, Shin (2015) Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partial-filling Ultraviolet Nanoimprint Lithography. In: Proceedings of the International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC 2015), 14-17 April 2015 , Kyoto, Japan. pp. 418-421..

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Abstract

Release agent becomes an imperative element in ultraviolet nanoimprint lithography (UV-NIL) for preventing the adhesive resin from adhering to the surface of antireflection structures (ARS) mold. However, complete filling the resin of a high-aspect-ratio ARS mold during UV-NIL generates a strong release force (RF) that deteriorates the release agent and shortens the lifetime of the ARS mold. In this paper, we proposed a technique of partial-filling UV-NIL in order to reduce the RF and consequently, prolong the lifetime of the release agent on ARS mold. The release and optical properties of the ARS were measured to determine the lifetime of the release agent on the mold, and complete-filling UV-NIL was also executed for comparison. By means of partial-filling UV-NIL, we successfully fabricated ARS films with excellent performance up to 75th imprint compared to complete-filling UV-NIL up to the 40th imprint.

Item Type: Conference or Workshop Item (Speech)
Additional Information: ISBN: 978-4-9040-9012-1 INSPEC Accession Number: 15144209
Uncontrolled Keywords: ultraviolet nanoimprint (NIL); lifetime; partial filling; release force; contact angle
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty/Division: Faculty of Electrical & Electronic Engineering
Depositing User: Mrs. Neng Sury Sulaiman
Date Deposited: 22 Jun 2015 07:09
Last Modified: 28 Jun 2018 01:08
URI: http://umpir.ump.edu.my/id/eprint/9274
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