Items where Author is "Kawarada, Hiroshi"
Up a level |
Khairul, Mohd Arshad and Muhamad, Mat Noor and Asrulnizam, Abd Manaf and Kawarada, Hiroshi and Shaili Falina, Mohd Sukri and Mohd Nasyriq, Syamsul (2022) A comparative modelling study of new robust packaging technology 1 mm2 VCSEL packages and their mechanical stress properties. Micromachines, 13 (1513). pp. 1-15. ISSN 2072-666X. (Published)
Khairul, Mohd Arshad and Muhamad, Mat Noor and Asrulnizam, Abd Manaf and Kawarada, Hiroshi and Falina, Shaili and Mohd, Syamsul (2022) A comparative modelling study of new robust packaging technology 1mm2 VCSEL packages and their mechanical stress properties. Micromachines, 13 (1513). pp. 1-15. ISSN 2072-666X. (Published)