Items where Author is "Kesavarma, Seluraju"

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Conference or Workshop Item

Kesavarma, Seluraju and E. H., Lee and M., Samykano and K., Kadirgama and M. M., Rahman and A. G. N., Sofiah (2020) Flextural properties of 3D printed Copper-Filler Polylactic Acid (Cu-PLA). In: IOP Conference Series: Materials Science and Engineering, 5th International Conference on Mechanical Engineering Research (ICMER 2019) , 30 - 31 July 2019 , Vistana Hotel, Kuantan, Pahang. pp. 1-11., 788 (012051). ISSN 1757-8981 (Print), 1757-899X (Online)


Kesavarma, Seluraju (2022) Investigation of mechanical behavior and properties prediction modelling of copper-filled filament for 3d printing. Masters thesis, Universiti Malaysia Pahang (Contributors, Thesis advisor: Mahendran, Samykano).

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