Items where Author is "Y. T., Chin"
 | Up a level |
Group by: Item Type | No Grouping
Jump to: Conference or Workshop Item
Number of items: 1.
Conference or Workshop Item
Siti Rabiatull Aisha, Idris and Ali, Ourdjini and Y. T., Chin (2012) Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper. In: Proceedings of the 35th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 2012) , 6-8 November 2012 , Kinta Riverfront Hotel, Ipoh, Perak. pp. 1-3.. (Published)