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Items where Author is "Y. T., Chin"

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Conference or Workshop Item

Siti Rabiatull Aisha, Idris and Ali, Ourdjini and Y. T., Chin (2012) Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper. In: Proceedings of the 35th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 2012), 6-8 November 2012 , Kinta Riverfront Hotel, Ipoh, Perak. pp. 1-3..

This list was generated on Thu Feb 27 01:26:05 2020 +08.