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M. H., Mohd Zaki and S. R. A., Idris (2023) A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering. In: Lecture Notes in Mechanical Engineering; 6th International Conference in Mechanical Engineering Research, ICMER 2021 , 26 - 27 October 2021 , Virtual, Online. pp. 815-824.. ISSN 2195-4356 ISBN 978-981-19-1456-0 (Published)

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