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Siti Rabiatull Aisha, Idris and Ali, Ourdjini and Y. T., Chin (2012) Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper. In: Proceedings of the 35th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 2012) , 6-8 November 2012 , Kinta Riverfront Hotel, Ipoh, Perak. pp. 1-3.. (Published)