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Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Azmah Hanim, Mohamad Ariff and Saliza Azlina, Osman (2015) Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method. International Journal of Computational Methods and Experimental Measurements, 3 (4). pp. 329-339. ISSN 2046-0546 (print); 2046-0554 (online)

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Abstract

In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt% (low), 5–8 wt% (medium) and above 8 wt% (high). The results reveal that the high phosphorus content in nickel layer acts as a good diffusion barrier for Sn–4Ag–0.5Cu since it can suppress the intermetallic compound formation. This is because in higher phosphorus content, the grain boundaries were found to be eliminated. Hence, resulted in thinner intermetallic compound thickness.

Item Type: Article
Uncontrolled Keywords: Diffusion barrier layer; intermetallic compound; nickel–phosphorus
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TN Mining engineering. Metallurgy
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Dr. Siti Rabiatull Aisha Idris
Date Deposited: 24 Feb 2016 06:47
Last Modified: 15 Jan 2018 07:44
URI: http://umpir.ump.edu.my/id/eprint/11846
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