Shamsul, Zakaria and Madsen, Frederikke B. and Skov, Anne Ladegaard (2017) Post-Curing as an Effective Means of Ensuring the Long-Term Reliability of PDMS Thin Films for Dielectric Elastomer Applications. Polymer-Plastics Technology and Engineering, 56 (1). pp. 83-95. ISSN 0360-2559 (Print); 1525-6111 (Online). (Published)
|
PDF
Post Curing as an Effective Means of Ensuring the Long term Reliability of PDMS Thin Films for Dielectric Elastomer Applications.pdf Download (1MB) | Preview |
Abstract
Post-curing can be used to facilitate volatile removal and thus produce PDMS films with stable elastic and electrical properties over time. In this study, the effect of post-curing was investigated for commercial silicone elastomer thin-films as a means of improving long-term elastomer film reliability. The Young's moduli and electrical breakdown strengths of commercial (silica-reinforced) PDMS elastomer films, with and without additional 35 parts per hundred rubber (phr) titanium dioxide (TiO2), were investigated after high-temperature (200°C) post-curing for various timespans. The elastomers were found to contain less than 2% of volatiles (significantly higher for TiO2-filled samples), but nevertheless a strong effect from post-curing was observed. The young's moduli as well as the strain-dependent behaviour were found to change significantly upon post-curing treatment where Young's moduli at 5% strain increases with post-cure. Furthermore, the determined dielectric breakdown parameters from Weibull analyses showed that greater electrical stability and reliability could be achieved by post-curing the PDMS films before usage, and this method therefore paves a way towards more reliable dielectric elastomers.
Item Type: | Article |
---|---|
Uncontrolled Keywords: | ageing, elastomers, mechanical properties, silicones, thin films |
Subjects: | Q Science > QD Chemistry |
Faculty/Division: | Faculty of Industrial Sciences And Technology |
Depositing User: | Mr. Shamsul Zakaria |
Date Deposited: | 29 Dec 2016 04:17 |
Last Modified: | 25 Jul 2018 07:57 |
URI: | http://umpir.ump.edu.my/id/eprint/14401 |
Download Statistic: | View Download Statistics |
Actions (login required)
View Item |