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Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method

Maliessa Nabilah, Mazelan and Siti Rabiatull Aisha, Idris (2019) Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method. In: 1st International Postgraduate Conference on Mechanical Engineering, IPCME 2018, 31 Oktober 2018 , Universiti Malaysia Pahang, Pekan. pp. 1-9., 469 (1). ISSN 1757-8981 (Submitted)

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Abstract

Microwave hybrid heating (MHH) has been recognized for soldering process especially with lead-free solder alloy. This study seeks to investigates the effect of different amount of susceptor on the Sn-3.0Ag-0.5Cu-Copper (SAC305-Cu) joint performance by using MHH method. The susceptor material that was used to facilitate microwave heating in this study was Silicone Carbide (SiC). Different amount of SiC were used to compare its effect on the intermetallic compound (IMC) formed and shear strength at the solder joint. Domestic microwave with operating frequency 2.45GHz and 800W was used to join the solder and Cu substrate for 5, 6 and 7 minutes. Characterization of the samples were carried out using optical microscope, image analyzer and lap shear test. Microstructural study showed that scallop type structure of Cu6Sn5 was found at the SAC305/Cu interface after soldering with MHH technique. Thinnest Cu6Sn5 IMC (14.909μm) were obtained by soldering with 6g of SiC for 6 minutes while highest shear strength were observed when 4g of SiC were used for soldering for 7 minutes (26.71 MPa).

Item Type: Conference or Workshop Item (Lecture)
Additional Information: Indexed by Scopus
Uncontrolled Keywords: Soldering; Microwave hybrid heating; Intermetallic compound
Subjects: T Technology > TJ Mechanical engineering and machinery
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Pn. Hazlinda Abd Rahman
Date Deposited: 17 Sep 2019 01:27
Last Modified: 17 Sep 2019 01:27
URI: http://umpir.ump.edu.my/id/eprint/24327
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