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A review on mechanical properties of SnAgCu/Cu joint using laser soldering

Nabila, Tamar Jaya and Siti Rabiatull Aisha, Idris and M., Ishak (2018) A review on mechanical properties of SnAgCu/Cu joint using laser soldering. In: The Advances in Joining Technology. Lecture Notes in Mechanical Engineering . Springer, Singapore, pp. 97-107. ISBN 9978-981-10-9040-0

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Abstract

This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects towards mechanical properties of the solder joint. This paper approach on the review of the solder joint strength which regards to intermetallic compound type and thickness. The output of this paper is to create an understanding for the readers about variance of laser soldering parameters and its effect on the mechanical properties of the solder joint by including discussion from other research paper findings.

Item Type: Book Section
Uncontrolled Keywords: Mechanical properties; Soldering; Metallurgy; Intermetallic compound
Subjects: T Technology > TJ Mechanical engineering and machinery
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Pn. Hazlinda Abd Rahman
Date Deposited: 15 Apr 2019 06:22
Last Modified: 15 Apr 2019 06:22
URI: http://umpir.ump.edu.my/id/eprint/24641
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