Ayib Rosdi, Zainun and M. H., Mamat and U. M., Noor and R., Yusop (2011) Particles size and conductivity study of P-Type copper (I) iodide (CUI) thin film for solid state dye-sensitized solar cells. In: Conference on Advanced Materials and Nanotechnology (CAMAN 2009) , 3-5 November 2009 , Kuala Lumpur. pp. 1-7., 17 (012009). ISSN 1757-8981 (Print), 1757-899X (Online)
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Particles size and conductivity study of P-Type copper (I) iodide (CUI) thin film for solid state dye-sensitized solar cells.pdf Download (3MB) | Preview |
Abstract
Copper Iodide based dye-sensitized solar cells (DSSC) has been reported either deliver small photocurrents or highly unstable. In this research, by added in a small amount of Tetra-methyl-ethylene-diamine (TMED) into CuI sol-gel (CuI in acetonitrile), performance of electrical properties and optical properties of CuI based DSSC have been studied. Particles size and conductivity of CuI solution were measured when addition of TMED to the sol at 0.05M concentrations. Spin-coating technique has been explored to prepare nano-crystalline CuI films at room temperature. The film was examined for their surface morphology, optical and electrical properties by field emission scanning electron microscope (FESEM), ultraviolet visible spectroscopy (UV-Vis), Photoluminescence (PL) and current-voltage (I-V) measurement respectively. The results were then compared with CuI sol-gel which prepared by dissolving CuI powder with acetonitrile only. It showed some improvement to the CuI-based DSSC by incorporation of a small quantity of TMED in the solution of precursor.
Item Type: | Conference or Workshop Item (Lecture) |
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Uncontrolled Keywords: | Copper iodide; Current-voltage measurements; Dye-Sensitized solar cell |
Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
Faculty/Division: | Faculty of Electrical & Electronic Engineering |
Depositing User: | Mrs. Neng Sury Sulaiman |
Date Deposited: | 30 May 2019 07:18 |
Last Modified: | 30 May 2019 07:18 |
URI: | http://umpir.ump.edu.my/id/eprint/24994 |
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