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Surface crack growth prediction under fatigue load using the S-version Finite Element Model (S-FEM)

M. N. M., Husnain and M. R. M., Akramin and Z. L., Chuan (2019) Surface crack growth prediction under fatigue load using the S-version Finite Element Model (S-FEM). In: IOP Conference Series: Materials Science and Engineering, 1st International Postgraduate Conference on Mechanical Engineering (IPCME2018), 31 October 2018 , UMP Library, Pekan. pp. 1-11., 469 (012011). ISSN 1757-899X

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Abstract

Prediction of fatigue crack growth is one of the vital issues to prevent catastrophic failure from damage tolerance perspective. The surface of crack shape usually in semi-elliptical that maintained during the whole propagation. The investigation of this paper is to illustrate the surface crack growth that subjected to fatigue loading. The four-point bending and three-point bending have been simulated by using the S-version Finite Element Model (S-FEM). The simulation is conducted for aluminium alloys A7075-T6 and A2017-T3 with all of the parameters based on the previous experiment. The semi-elliptical crack shape is applied during the simulation process to represent with the reality of crack growth phenomena. Paris’ Law model approach is presented in fatigue crack growth simulation. The S-FEM produced the surface crack growth and fatigue life prediction. The results of the S-FEM prediction then compared with the previous experiments. The results presented in a graph for comparison between S-FEM prediction with the experimental results. The S-FEM results obtained is good agreement with the experiment results.

Item Type: Conference or Workshop Item (Lecture)
Uncontrolled Keywords: S-version Finite Element Model (S-FEM); fatigue crack growth; prediction
Subjects: T Technology > TJ Mechanical engineering and machinery
Faculty/Division: Faculty of Mechanical Engineering
Faculty of Industrial Sciences And Technology
Depositing User: Dr. Mohd Akramin Mohd Romlay
Date Deposited: 28 Aug 2019 03:12
Last Modified: 28 Aug 2019 03:12
URI: http://umpir.ump.edu.my/id/eprint/25720
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