Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review

Nabila, Tamar Jaya and Siti Rabiatull Aisha, Idris (2019) Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review. In: Electronic Packaging Interconnect Technology Symposium, 22-26 November 2019 , Penang, Malaysia. pp. 1-9.. (Unpublished)

[img] Pdf
25. Fibre laser soldering operation and its effect.pdf
Restricted to Repository staff only

Download (226kB) | Request a copy
25.1 Fibre laser soldering operation and its effect.pdf

Download (91kB) | Preview


Nowadays the application of laser technology in microelectronic packaging has been widely implemented in many developed countries. Its flexibility on setting the parameters by following individual’s requirement, localized heating, non-contact heating, fast heating and cooling rate makes it one of the best choice for creating a joint between solder alloy and printed circuit board in microelectronic devices. Laser soldering method ease the automation process and its ability of directing the energy beam onto desired target area is seen as an advantage compared to other conventional soldering methods such as reflow soldering (infra-red and hot air), vapour phase or hot-belt soldering whereas the entire assembly is passed through an oven to form solder joint with metallurgical bonding. Meanwhile, as in conjunction to support the banned usage of lead (Pb) in electronics, the lead-free solder alloy has been proposed as the best alternative solder to replace SnPb solders. Many researchers have also studied that Sn-Ag-Cu solder alloy group have a better melting temperature that is in between 216-227 in degrees Celsius compared to Sn-Pb melting temperature (183ºC). This paper will focus on fibre laser operation with regards to soldering process and also its effect towards intermetallic compound formation at the solder joint.

Item Type: Conference or Workshop Item (Lecture)
Uncontrolled Keywords: Workplace Risk Assessment; Hazard Identification; Risk Assessment
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty/Division: Faculty of Mechanical and Automotive Engineering Technology
Institute of Postgraduate Studies
Depositing User: Pn. Hazlinda Abd Rahman
Date Deposited: 18 Jan 2021 07:59
Last Modified: 18 Jan 2021 07:59
Download Statistic: View Download Statistics

Actions (login required)

View Item View Item