Microwave hybrid heating as an alternative method for soldering—A brief review

N. M., Maliessa and S. R. A., Idris (2023) Microwave hybrid heating as an alternative method for soldering—A brief review. In: Lecture Notes in Mechanical Engineering; 6th International Conference in Mechanical Engineering Research, ICMER 2021 , 26 - 27 October 2021 , Virtual, Online. pp. 565-577.. ISSN 2195-4356 ISBN 978-981191456-0

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Abstract

The paper reviews the Microwave Hybrid Heating (MHH) method as well as the effect of MHH towards the interfacial reaction and the shear strength at the solder/Cu joint. Previously, reflow soldering process was performed to solder electronic component. Due to its high defect rate, processing time and energy consumption, MHH method are getting more attention among electronics manufacturers to perform industrial process as it is beneficial in modern microtechnology. MHH method has faster heating rate, improve heating uniformity, reduces the chance of thermal runaway, reduce processing temperature, and reduce hazards to human and environment. This approach has proven to yield scallop-like and angular trapezoid structure of Cu6Sn5 and Cu3Sn in the intermetallic compound (IMC). The IMC thickness shows a competitive result (5.337μm and 5.717μm) compared to reflow soldering. However, not many studies were done on the shear strength of the solder joint.

Item Type:	Conference or Workshop Item (Lecture)
Additional Information:	Indexed by Scopus
Uncontrolled Keywords:	Microwave Hybrid Heating; Sn-Ag-Cu; susceptor.
Subjects:	T Technology > TS Manufactures
Faculty/Division:	Institute of Postgraduate Studies Faculty of Mechanical and Automotive Engineering Technology
Depositing User:	Noorul Farina Arifin
Date Deposited:	27 Jan 2022 07:23
Last Modified:	10 Nov 2023 03:18
URI:	http://umpir.ump.edu.my/id/eprint/33292
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