Experimental investigation on magnetorheological finishing process parameters

Abdul Wahab, Hashmi and Mali, Harlal Singh and Meena, Anoj and Khilji, Irshad Ahamad and Chilakamarry, Chaitanya Reddy and Siti Nadiah, Mohd Saffe (2022) Experimental investigation on magnetorheological finishing process parameters. In: Materials Today: Proceedings, Innovative Manufacturing, Mechatronics & Materials Forum 2021, 6 April 2021 , Virtual Conference, Universiti Malaysia Pahang, Malaysia. pp. 1892-1898., 48 (Part 6). ISSN 2214-7853

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Magneto-rheological polishing (MRP) fluid was developed by MR fluid using a magnetic field, non-magnetic abrasives such as SiC and Al2O3, and carrier medium like oil. A magnetic polishing tool was developed using a super-strong permanent neodymium magnet (Nd2Fe14B) with 0.5-tesla magnetic intensity. This polishing tool was assembled to the vertical milling machine for the finishing workpieces. In the present research, magnetic materials (steel material) and non-ferromagnetic (copper) content were finishing using a developed MRP setup for experimental investigation. This research also investigated the parametric dependencies of different abrasives on the magneto-rheological finishing process. It determined the effect of magnetic particle concentration and abrasives on the surface roughness of ferromagnetic (stainless steel) and non-ferromagnetic material (copper). The final surface roughness value has reached 30 nm from its initial surface roughness of 800 nm for non-ferromagnetic (copper). For the magnetic material (stainless steel), the value is 50 nm from 1300 nm.

Item Type: Conference or Workshop Item (Lecture)
Uncontrolled Keywords: Magnetorheological; Fluid; Nanofinishing; Polishing; Finishing
Subjects: T Technology > TJ Mechanical engineering and machinery
T Technology > TS Manufactures
Faculty/Division: Institute of Postgraduate Studies
Faculty of Manufacturing and Mechatronic Engineering Technology
Depositing User: Ms. Ratna Wilis Haryati Mustapa
Date Deposited: 01 Aug 2022 05:03
Last Modified: 28 Oct 2022 08:12
URI: http://umpir.ump.edu.my/id/eprint/34808
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