Design, optimization, fabrication and analysis of Cu microheater for loop-mediated isothermal amplification (LAMP) applications

Ezhilnavaroji, Jeroish Zachariah and Bhuvaneshwari, K. S. and Futane, Abhishek and Fahmi, Samsuri and Narayanamurthy, Vigneswaran (2023) Design, optimization, fabrication and analysis of Cu microheater for loop-mediated isothermal amplification (LAMP) applications. Materials Today Communications, 36 (106663). ISSN 2352-4928. (Published)

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DOI/Official URL: https://doi.org/10.1016/j.mtcomm.2023.106663

Abstract

A paper presents the design, fabrication, and thermal evaluation of a printed circuit board (PCB) based copper (Cu) microheater that can be integrated with microfluidic chips to initiate the loop-mediated isothermal amplification (LAMP). A series of 3D finite element electro-thermal simulations were carried out to analyze the thermal uniformity and power consumption of the micro heater. The optimal design was fabricated using the etching technique and analyzed with a heat spreader to enhance thermal uniformity. The simulation results of the microheater reveal that the meander configuration outperforms other designs. In addition, the microheater with a heat spreader has a thermal difference of only < 5 ℃ when compared with ∼10 ℃ in a microheater without a heat spreader. The developed microheater has a long shelf life and can be used to handle wet biological samples when encapsulated with polyethylene terephthalate (PET). The paper microfluidic chip on the glass substrate has a temperature difference of only 0.5 ℃. The low-cost microheater integrated microfluidic chips has the great potential to develop inexpensive home-based diagnostic kits and trigger the access of diagnostic kits in underdeveloped countries to reduce the spread of infection and initiate treatment plans.

Item Type:	Article
Additional Information:	indexed by Scopus
Uncontrolled Keywords:	PCB; Microfluidic chip; Microheater; LAM
Subjects:	T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty/Division:	Institute of Postgraduate Studies College of Engineering
Depositing User:	Miss Amelia Binti Hasan
Date Deposited:	14 Nov 2023 06:12
Last Modified:	14 Nov 2023 06:12
URI:	http://umpir.ump.edu.my/id/eprint/39298
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