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Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes

Siti Rabiatull Aisha, Idris and Ali, Ourdjini and Saliza Azlina, Osman (2011) Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes. International Journal of Microstructure and Materials Properties, 7 (6). pp. 502-516. ISSN 1741-8410 (print); 1741-8429 (online)

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Abstract

In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMC) formation of solder joints made from lead-free Sn-4Ag-0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG), immersion silver (ImAg) and Copper surface finishes are presented. After the first reflow soldering, the well-known intermetallic Cu6Sn5 was observed in ImAg and Copper of surface finishes. While for ENEPIG and ENIG, mainly, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was formed respectively. With increasing the number of reflows up to three, the thickness of intermetallics increased gradually and their grain sizes coarsened. The intermetallics growth kinetics showed that the interfacial phase Cu6Sn5, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was controlled mainly by grain boundary diffusion and that, the intermetallic growth on ENEPIG was found to be slowest among other surface finishes being used.

Item Type: Article
Additional Information: Indexed in Scopus (Elsevier), Compendex [formerly Ei] (Elsevier), Academic OneFile (Gale), Business and Company Resource Center (Gale). This paper presented at 1st International Conference and Exhibition of Women Engineer (ICEWE), Bukit Gambang Resort, Kuantan, Pahang, 20-22 November 2011
Uncontrolled Keywords: Multiple reflow; Intermetallic compound; Surface finish
Subjects: T Technology > TJ Mechanical engineering and machinery
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Dr. Siti Rabiatull Aisha Idris
Date Deposited: 25 Mar 2014 02:35
Last Modified: 15 Jan 2018 08:24
URI: http://umpir.ump.edu.my/id/eprint/5191
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