Items where Author is "Muhammad Asyraf, Abdullah"

Muhammad Asyraf, Abdullah (2024) Interfacial microstructure growth mechanism of lead-free solder using laser soldering. Masters thesis, Universiti Malaysia Pahang Al-Sultan Abdullah (Contributors, Thesis advisor: Siti Rabiatull Aisha, Idris).

Muhammad Asyraf, Abdullah and Siti Rabiatull Aisha, Idris (2023) Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering. In: Technological Advancement in Mechanical and Automotive Engineering: ICMER 2021 , 26-27 October 2021 , Virtual Conference, Universiti Malaysia Pahang. pp. 869-880.. ISBN 978-981-19-1457-7 (Published)

Siti Rabiatull Aisha, Idris and Nabila, Tamar Jaya and Muhammad Asyraf, Abdullah (2022) The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth. In: Recent Progress in Lead-Free Solder Technology. Springer, Switzerland AG, pp. 265-282. ISBN 978-3-030-93441-5

Muhammad Asyraf, Abdullah and Siti Rabiatull Aisha, Idris (2021) Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth. In: IOP Conference Series: Materials Science and Engineering, The 2nd International Conference on Innovative Technology, Engineering and Sciences (iCITES 2020) , 22 -23 December 2020 , Pekan, Pahang, Malaysia. pp. 1-9., 1092 (012012). ISSN 1757-899X (Published)