The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth

Siti Rabiatull Aisha, Idris and Nabila, Tamar Jaya and Muhammad Asyraf, Abdullah (2022) The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth. In: Recent Progress in Lead-Free Solder Technology. Springer, Switzerland AG, pp. 265-282. ISBN 978-3-030-93441-5

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Abstract

Recently, the laser soldering method has been introduced among electronic manufacturers because of its superior properties such as non-contact and localised heating, quick rise and drop in temperature, and ease of automation compared to reflow soldering. This paper discusses the effect of laser soldering parameters on intermetallic compound formation and growth between lead-free solder alloy and copper substrate. The analysis was conducted for the type of laser used for heat-sensitive components and characteristics of the laser soldering process, which could promote or inhibit excessive growth of intermetallic compound formation.

Item Type:	Book Chapter
Additional Information:	Part of the Topics in Mining, Metallurgy and Materials Engineering book series (TMMME)
Uncontrolled Keywords:	Lead-free solder alloy, Laser soldering, Intermetallic compound
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) T Technology > TJ Mechanical engineering and machinery T Technology > TN Mining engineering. Metallurgy
Faculty/Division:	Faculty of Mechanical and Automotive Engineering Technology
Depositing User:	Dr. Siti Rabiatull Aisha Idris
Date Deposited:	14 Apr 2022 07:11
Last Modified:	31 May 2022 00:13
URI:	http://umpir.ump.edu.my/id/eprint/33588
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