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Siti Faqihah, Roduan and Juyana, A. Wahab and Mohd Arif Anuar, Mohd Salleh and Nurul Aida Husna, Mohd Mahayuddin and Mohd Mustafa, Al Bakri Abdullah and Aiman, Mohd Halil and Amira Qistina Syamimi, Zaifuddin and Mahadzir, Ishak and Sandu, Andrei Victor and Baltatu, Mădălina Simona and Vizureanu, Petrica (2023) Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy. Materials, 16 (96). pp. 1-14. ISSN 1996-1944. (Published)

This list was generated on Sat Nov 23 17:50:34 2024 +08.