Siti Faqihah, Roduan and Juyana, A. Wahab and Mohd Arif Anuar, Mohd Salleh and Nurul Aida Husna, Mohd Mahayuddin and Mohd Mustafa, Al Bakri Abdullah and Aiman, Mohd Halil and Amira Qistina Syamimi, Zaifuddin and Mahadzir, Ishak and Sandu, Andrei Victor and Baltatu, Mădălina Simona and Vizureanu, Petrica (2023) Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy. Materials, 16 (96). pp. 1-14. ISSN 1996-1944. (Published)
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Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.pdf Available under License Creative Commons Attribution. Download (6MB) | Preview |
Abstract
This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
| Item Type: | Article |
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| Additional Information: | Indexed by Scopus |
| Uncontrolled Keywords: | Dimple microtexture; Intermetallic compound; Laser surface texturing; Lead-free solder; Wettability |
| Subjects: | T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) T Technology > TJ Mechanical engineering and machinery T Technology > TL Motor vehicles. Aeronautics. Astronautics |
| Faculty/Division: | Institute of Postgraduate Studies College of Engineering Faculty of Mechanical and Automotive Engineering Technology |
| Depositing User: | Mr Muhamad Firdaus Janih@Jaini |
| Date Deposited: | 04 Sep 2023 07:07 |
| Last Modified: | 04 Sep 2023 07:07 |
| URI: | http://umpir.ump.edu.my/id/eprint/38182 |
| Download Statistic: | View Download Statistics |
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