A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability

Hardinnawirda, Kahar and Zetty Akhtar, Abd Malek and Siti Rabiatull Aisha, Idris (2017) A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability. In: High Performance and Optimum Design of Structures and Materials II. WIT Transactions on The Built Environmen. WIT Press, pp. 1-3. ISBN 9781784661434

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Abstract

The increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders providing an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for evaluation of the solder joint reliability with respect to solder alloys and surface finishes. However, as the demand of electronic devices is increasing, there is a need to improve the mechanical properties of the solder joint in order to keep up with the current evolution of electronic device's technology. In this study, the effect of surface finish and cooling rate on solder joint reliability using Nickel-based surface finish was summarizes. Study was focusing on Nickel based surface finish (ENIG and ENEPIG) with different cooling medium, slow (furnace), medium (air) and fast (water). It was found that the type of surface finish and the cooling rate can change the morphology of the solder intermetallic compound (IMC) and directly changes the solder joint mechanical properties. Faster cooling rate was reported to provide finer IMC grains which might be translated into a better solder joint strength. The findings presented here may provide a better understanding for a further study and facilitate improvements in term of solder joint reliability.

Item Type:	Book Chapter
Uncontrolled Keywords:	solder alloy, surface finish, interfacial reaction, solder joint and cooling rate.
Subjects:	T Technology > TJ Mechanical engineering and machinery
Faculty/Division:	Faculty of Mechanical Engineering
Depositing User:	Mrs. Neng Sury Sulaiman
Date Deposited:	26 Oct 2015 02:55
Last Modified:	15 Jan 2018 04:27
URI:	http://umpir.ump.edu.my/id/eprint/10492
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