Toh, Ban Sheng (2009) Reverse engineering of mobile phone casing and analysis of weld-line defect. Faculty of Mechanical Engineering, Universiti Malaysia Pahang.
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Abstract
In recent decades, reverse engineering (RE) has gradually become important when it comes to the situation that a component must be reproduced but its original engineering data are no longer or not accessible. Sophisticated technologies are introduced for the purpose of reverse engineering. The state-of-the-art technology in latest days is the use of 3D laser scanning with aid of reverse-engineering software to create the 3D geometry model of the existing component. The most appropriate way to duplicate the component is by plastic injection moulding. However, defect such as weld lines always occur during injection moulding process which makes the component aesthetically and structurally unacceptable. Therefore, injection moulding simulation on the component is necessary to investigate the variables that affect the formation of weld lines. Simulations are repetitively done to determine the most optimal variables that remove or reduce weld lines to minimum before the component is ready for reproduction.
| Item Type: | Undergraduates Project Papers |
|---|---|
| Additional Information: | Project paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2009 , SV:En. Asnul Hadi Bin Ahmad , No. CD:4232 |
| Uncontrolled Keywords: | Injection moulding of plastics; Plastics -- Moulding; Reverse engineering |
| Subjects: | T Technology > TP Chemical technology |
| Faculty/Division: | Faculty of Mechanical Engineering |
| Depositing User: | Rosfadilla Mohamad Zainun |
| Date Deposited: | 01 Feb 2011 02:34 |
| Last Modified: | 23 Nov 2023 07:49 |
| URI: | http://umpir.ump.edu.my/id/eprint/1098 |
| Download Statistic: | View Download Statistics |
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