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Computational analysis of heat conduction in nanowood composite boards

Hazan Idayu, Abdul Halim (2012) Computational analysis of heat conduction in nanowood composite boards. Faculty of Mechanical Engineering, Universiti Malaysia Pahang.

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Computational analysis of heat conduction in nanowood composite boards (Table of content).pdf - Accepted Version

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Computational analysis of heat conduction in nanowood composite boards (Abstract).pdf - Accepted Version

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Computational analysis of heat conduction in nanowood composite boards (Chapter 1).pdf - Accepted Version

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Abstract

This project deals with the investigation of heat transfer problem or specifically heat conduction problem through wood-based material. The objectives of this project are to determine the thermal conductivity of nanowood composite boards having different particle concentrations and to investigate heat conduction problem of wood composites. The thesis describes the proper manufacturing process of Medium Density Fiberboard (MDF) in order to investigate the thermal properties and mechanical properties woodbased material. The nanoparticle was used as the raw material to produce MDF. The studies of mechanical properties that are involved in this project consist of hardness of the MDF. For thermal properties of MDFs, we observed the thermal conductivity, thermal resistivity, thermal diffusivity and specific heat capacity of them using KD2 Pro apparatus. As for the recommendation, the thermal properties should be considered in order to optimally select a material for its specific application.

Item Type: Undergraduates Project Papers
Additional Information: Project paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2012, SV: Dr. Korada Viswanatha Sharma
Uncontrolled Keywords: Heat; Transmission
Subjects: T Technology > TJ Mechanical engineering and machinery
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Nik Ahmad Nasyrun Nik Abd Malik
Date Deposited: 06 Jan 2014 03:05
Last Modified: 07 Apr 2017 02:11
URI: http://umpir.ump.edu.my/id/eprint/4643
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