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Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish

Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini and Astuty, Amrin (2014) Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish. Advanced Materials Research, 845. pp. 76-80. ISSN 1022-6680 (print), 1662-8985 (online)

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Abstract

The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn4.0Ag-0.5Cu (SAC405) and electroless nickel (boron)/ immersion palladium/immersion gold (EN(B)EPIG). Reliability of solder joint has also been investigated by performing solid state isothermal aging at 125˚C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time of solder joints resulted in an increase in IMC thickness and a change in morphology into more spherical, dense and with larger grain size. By using optical microscope, the average thickness of the intermetallics was measured and it found that the larger solder balls produced thicker IMC than the smaller solder balls during reflow soldering. However, after aging the smaller solders produced thicker IMC than the larger solders.

Item Type: Article
Uncontrolled Keywords: Intermetallic Compound; Isothermal Aging; Lead-Free Solder; Soldering; Surface Finish
Subjects: T Technology > T Technology (General)
T Technology > TN Mining engineering. Metallurgy
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Dr. Siti Rabiatull Aisha Idris
Date Deposited: 08 Apr 2014 02:47
Last Modified: 15 Jan 2018 07:48
URI: http://umpir.ump.edu.my/id/eprint/5201
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