Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish

Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini and Azmah Hanim, Mohamad Ariff (2012) Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish. Advanced Materials Research, 415-417. pp. 1181-1185. ISSN 1022-6680 (print), 1662-8985 (online). (Published)

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In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this requirement. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn-3.0Ag-0.5Cu (SAC305) and electroless nickel/ immersion palladium/immersion gold (ENEPIG). Reliability of solder joint is also examined by performing solid state isothermal aging at 125˚C and 150˚C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time and temperature of solder joints results in an increase of IMC’s thickness and changes their morphologies to become more spherical, dense and with larger grain size. In addition, the results also revealed that the thickness of intermetallics formed is proportional to the aging duration and temperature.

Item Type: Article
Uncontrolled Keywords: ENEPIG; Intermetallic compound (IMC); Lead-free solder; Surface finish and isothermal aging
Subjects: T Technology > T Technology (General)
T Technology > TN Mining engineering. Metallurgy
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Dr. Siti Rabiatull Aisha Idris
Date Deposited: 08 Apr 2014 02:52
Last Modified: 15 Jan 2018 08:22
URI: http://umpir.ump.edu.my/id/eprint/5202
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