Siti Rabiatull Aisha, Idris and Noor, Farihan and Hardinnawirda, Kahar (2016) Effect of Flux onto Intermetallic Compound Formation and Growth. In: MATEC Web of Conferences: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015) , 18-19 August 2015 , Zenith Hotel, Kuantan, Pahang, Malaysia. pp. 1-3., 74 (00034). ISSN 2261-236X
|
PDF
fkm-2016-aisha-effect of flux.pdf Available under License Creative Commons Attribution. Download (863kB) | Preview |
Abstract
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.
| Item Type: | Conference or Workshop Item (Speech) |
|---|---|
| Uncontrolled Keywords: | No-clean flux; Solder joint; Intermetallic compound. |
| Subjects: | T Technology > T Technology (General) T Technology > TJ Mechanical engineering and machinery |
| Faculty/Division: | Faculty of Mechanical Engineering |
| Depositing User: | Ms. Nurul Hamira Abd Razak |
| Date Deposited: | 09 Nov 2016 08:11 |
| Last Modified: | 15 Jan 2018 07:33 |
| URI: | http://umpir.ump.edu.my/id/eprint/14487 |
| Download Statistic: | View Download Statistics |
Actions (login required)
 |
View Item |