UMP Institutional Repository

Effect of Flux onto Intermetallic Compound Formation and Growth

Siti Rabiatull Aisha, Idris and Noor, Farihan and Hardinnawirda, Kahar (2016) Effect of Flux onto Intermetallic Compound Formation and Growth. In: MATEC Web of Conferences: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015), 18-19 August 2015 , Zenith Hotel, Kuantan, Pahang, Malaysia. pp. 1-3., 74 (00034). ISSN 2261-236X

[img]
Preview
PDF
fkm-2016-aisha-effect of flux.pdf
Available under License Creative Commons Attribution.

Download (863kB) | Preview

Abstract

In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.

Item Type: Conference or Workshop Item (Speech)
Uncontrolled Keywords: No-clean flux; Solder joint; Intermetallic compound.
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Ms. Nurul Hamira Abd Razak
Date Deposited: 09 Nov 2016 08:11
Last Modified: 15 Jan 2018 07:33
URI: http://umpir.ump.edu.my/id/eprint/14487
Download Statistic: View Download Statistics

Actions (login required)

View Item View Item