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Effect of Flux onto Intermetallic Compound Formation and Growth

Siti Rabiatull Aisha, Idris and Noor, Farihan and Hardinnawirda, Kahar (2016) Effect of Flux onto Intermetallic Compound Formation and Growth. In: MATEC Web of Conferences: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015), 18-19 August 2015 , Zenith Hotel, Kuantan, Pahang, Malaysia. pp. 1-3., 74 (00034). ISSN 2261-236X

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In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.

Item Type: Conference or Workshop Item (Speech)
Uncontrolled Keywords: No-clean flux; Solder joint; Intermetallic compound.
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
Faculty/Division: Faculty of Mechanical Engineering
Depositing User: Ms. Nurul Hamira Abd Razak
Date Deposited: 09 Nov 2016 08:11
Last Modified: 15 Jan 2018 07:33
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