Roduan, Siti Faqihah and Wahab, J. A. and Aiman, M. H. and Zaifuddin, A. Q. and Mohd Salleh, M. A. A. and Mahadzir, I. (2019) Effect of laser loop on surface morphology of copper substrate and wettability of solder joint. In: IOP Conference Series: Materials Science and Engineering; Electronic Packaging Interconnect Technology Symposium 2019, EPITS 2019 , 24 - 25 November 2019 , Penang. pp. 1-8., 701 (012040). ISSN 1757-8981
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Effect of laser loop on surface morphology of copper substrate and wettability of solder joint.pdf Available under License Creative Commons Attribution. Download (598kB) | Preview |
Abstract
The effect of different laser loop parameter on the geometry of micro-groove pattern on copper substrate and its effect on the wettability was investigated. The micro-grooves pattern was fabricated on the copper surface through laser surface texturing process. 3D measuring laser microscope and contact angle measurement test was conducted to measure the geometry of the micro-grooves pattern and wettability of the solder joint respectively. The results showed that the improvement in laser loop parameter increased the depth of the micro-grooves due to the more exposed time which allows more material ablation. It also showed that the contact angle of textured substrate is smaller than the untextured substrate which results in better wettability.
| Item Type: | Conference or Workshop Item (Lecture) |
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| Additional Information: | Indexed by Scopus |
| Uncontrolled Keywords: | Copper substrates; Copper surface; Laser microscopes; Laser surface texturing; Loop parameters; Material ablation; Solder joints; Textured substrates |
| Subjects: | T Technology > T Technology (General) T Technology > TJ Mechanical engineering and machinery T Technology > TL Motor vehicles. Aeronautics. Astronautics |
| Faculty/Division: | Institute of Postgraduate Studies Faculty of Mechanical and Automotive Engineering Technology |
| Depositing User: | Mr Muhamad Firdaus Janih@Jaini |
| Date Deposited: | 10 Apr 2023 03:14 |
| Last Modified: | 10 Apr 2023 03:14 |
| URI: | http://umpir.ump.edu.my/id/eprint/35901 |
| Download Statistic: | View Download Statistics |
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