A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering

M. H., Mohd Zaki and S. R. A., Idris (2023) A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering. In: Lecture Notes in Mechanical Engineering; 6th International Conference in Mechanical Engineering Research, ICMER 2021 , 26 - 27 October 2021 , Virtual, Online. pp. 815-824.. ISSN 2195-4356 ISBN 978-981-19-1456-0

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Abstract

Reflow soldering is a process to create joining between the board and electronic component in order to make sure the electronic devices may function well. The aim of this study is to determine the solder joint strength through simulations using data from previous researchers. Two type of solder alloys were used namely Sn3Ag0.5Cu (SAC305) and Sn0.7Cu (SC07) with two types of substrate such as laminated copper and pure copper. Simulation was conducted using Fusion 360 software. Besides, the information and data on intermetallic compound formation and growth, as well as thickness were gathered and presented in this study to support the simulation results. Results showed that pure SAC305/copper substrate produced lower shear strength which was 15.17 MPa as compared to SAC305/laminated copper with the value of 26.67 MPa. Meanwhile SC07/pure copper also gave lower shear strength which was 5.62 MPa as compared to SC07/laminated copper which was 5.45 MPa. In terms of IMC, it was found that mainly Cu6Sn5 was formed at the solder joint interface with an average thickness of 3 µm for SAC305, and 5 µm for SC07 for both substrates. Hence it can be concluded that SAC305 with laminated copper substrate showed a good performance to produce a reliable electronics product.

Item Type:	Conference or Workshop Item (Lecture)
Additional Information:	Indexed by Scopus
Uncontrolled Keywords:	Reflow soldering; Solder alloy; Intermetallic compound; Solder joint strength
Subjects:	T Technology > T Technology (General) T Technology > TJ Mechanical engineering and machinery
Faculty/Division:	Institute of Postgraduate Studies Faculty of Mechanical and Automotive Engineering Technology
Depositing User:	Mrs Norsaini Abdul Samat
Date Deposited:	28 Nov 2023 07:36
Last Modified:	28 Nov 2023 07:36
URI:	http://umpir.ump.edu.my/id/eprint/39416
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