Manda, M. S. and M. R. M., Rejab and A.H, Shukur and S.S, Amirnuddin and M.K, Kasmar (2022) Analytical Model Evaluation on Tin Slag Polymer Concrete Behavior under Compression. In: Proceedings of the International Conference on Aerospace & Mechanical Engineering (ICAME 21). International Conference on Aerospace & Mechanical Engineering (ICAME 21) , 16-18 December 2021 , India. .
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Abstract
Tin Slag Polymer Concrete (TSPC) is a new material and there was no available analytical model that has been used in describing its behavior. This study has employed a previous analytical model to represent TSPC compressive behavior, especially in the stress-strain relationship of concrete material. Hognestad model, Desayi & Krishnan model, Popovics model and Carreira & Chu model have been considered in this evaluation. The experimental data from the previous researchers are referred to predict the relationship and validated the analytical model computation. Comparison is made by the shape of the stress-strain curve, elastic modulus, yield strength and maximum strength. Carreira & Chu model has been found as the best analytical model that may be employed to describe TSPC behavior under compression. The predicted shape of the stress-strain curve, elastic modulus, yield strength and maximum strength has shown a good match with experimental data and true data. These findings may facilitate future parametric study based on the analytical model with the addition of confining pressure factors to evaluate the external strengthening effect on TSPC strength.
Item Type: | Conference or Workshop Item (Paper) |
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Uncontrolled Keywords: | TSPC, Compression, stress-strain, analytical model, elastic modulus, yield strength, maximum strength |
Subjects: | T Technology > TJ Mechanical engineering and machinery |
Faculty/Division: | Institute of Postgraduate Studies Faculty of Mechanical and Automotive Engineering Technology |
Depositing User: | Miss Amelia Binti Hasan |
Date Deposited: | 17 Jan 2024 01:43 |
Last Modified: | 17 Jan 2024 01:43 |
URI: | http://umpir.ump.edu.my/id/eprint/40049 |
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