Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Bashir, M. Nasir and Saad, Hafiz Muhammad and Muhammad, Rizwan and Quazi, Moinuddin Mohammed and Ali, Muhammad Mahmood and Ahmed, Arslan E.M. and Zaidi, Asad Ali and Soudagar, Manzoore Elahi M. and Haseeb, Abdul S.Md Abdul and Naher, Sumsun (2022) Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint. Journal of Materials Science: Materials in Electronics, 33 (28). pp. 22499-22507. ISSN 0957-4522. (Published)

	Pdf Effects of tin particles addition on structural and mechanical.pdf Restricted to Repository staff only Download (2MB) | Request a copy
Preview	Pdf Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint_ABS.pdf Download (171kB) | Preview

Abstract

Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.

Item Type:	Article
Additional Information:	Indexed by Scopus
Uncontrolled Keywords:	Copper; Soldering alloys; Intermetallics
Subjects:	T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) T Technology > TJ Mechanical engineering and machinery T Technology > TL Motor vehicles. Aeronautics. Astronautics
Faculty/Division:	Faculty of Mechanical and Automotive Engineering Technology
Depositing User:	Mr Muhamad Firdaus Janih@Jaini
Date Deposited:	08 Feb 2024 04:40
Last Modified:	08 Feb 2024 04:40
URI:	http://umpir.ump.edu.my/id/eprint/40187
Download Statistic:	View Download Statistics

Actions (login required)

View Item