Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix

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Abstract

Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and β-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of β-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of β-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint.

Item Type:	Article
Additional Information:	Indexed by Scopus
Uncontrolled Keywords:	Intermetallics; Tin alloys; Solder joint
Subjects:	T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) T Technology > TJ Mechanical engineering and machinery T Technology > TL Motor vehicles. Aeronautics. Astronautics
Faculty/Division:	Faculty of Mechanical and Automotive Engineering Technology
Depositing User:	Mr Muhamad Firdaus Janih@Jaini
Date Deposited:	07 Jan 2025 03:54
Last Modified:	07 Jan 2025 03:54
URI:	http://umpir.ump.edu.my/id/eprint/42710
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