Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix

Bashir, Muhammad Nasir and Haseeb, Abdul S.Md Abdul and Wakeel, Saif and Khan, Muhammad Ali and Quazi, Moinuddin Mohammed and Khan, Niaz Bahadur and Ahmed, Arslan and Soudagar, Manzoore Elahi M. (2022) Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix. Journal of Materials Science: Materials in Electronics, 33 (25). pp. 20106-20120. ISSN 0957-4522. (Published)

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Abstract

Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and β-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of β-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of β-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint.

Item Type: Article
Additional Information: Indexed by Scopus
Uncontrolled Keywords: Intermetallics; Tin alloys; Solder joint
Subjects: T Technology > T Technology (General)
T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TJ Mechanical engineering and machinery
T Technology > TL Motor vehicles. Aeronautics. Astronautics
Faculty/Division: Faculty of Mechanical and Automotive Engineering Technology
Depositing User: Mr Muhamad Firdaus Janih@Jaini
Date Deposited: 07 Jan 2025 03:54
Last Modified: 07 Jan 2025 03:54
URI: http://umpir.ump.edu.my/id/eprint/42710
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