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Items where Author is "Ali, Ourdjini"

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Number of items: 8.

Article

Siti Rabiatull Aisha, Idris and Azmah Hanim, Mohamad Ariff and Ali, Ourdjini and Saliza Azlina, Osman (2015) Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes. Journal of Mechanical Engineering and Sciences (JMES) , 9. pp. 1572-1579. ISSN 2289-4659 (print); 2231-8380 (online)

Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini and Astuty, Amrin (2014) Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish. Advanced Materials Research, 845. pp. 76-80. ISSN 1022-6680 (print), 1662-8985 (online)

Siti Rabiatull Aisha, Idris and Azmah Hanim, Mohamad Ariff and Ali, Ourdjini and Saliza Azlina, Osman (2013) Effect of Isothermal Aging 2000 Hours on Intermetallics Formed Between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders. Advanced Materials Research, 650. pp. 194-199. ISSN 1022-6680 (print), 1662-8985 (online)

Siti Rabiatull Aisha, Idris and Ali, Ourdjini (2013) Effect of Multiple Reflow on IMC Formation using Various Surface Finishes. International Journal of Microstructure and Materials Properties, 7 (6). pp. 502-516. ISSN 1741-8410 (print); 1741-8429 (online)

Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini (2012) Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate. Advanced Materials Research, 488-48. pp. 1375-1379. ISSN 1022-6680 (print), 1662-8985 (online)

Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini and Azmah Hanim, Mohamad Ariff (2012) Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish. Advanced Materials Research, 415-417. pp. 1181-1185. ISSN 1022-6680 (print), 1662-8985 (online)

Siti Rabiatull Aisha, Idris and Ali, Ourdjini and Saliza Azlina, Osman (2011) Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes. International Journal of Microstructure and Materials Properties, 7 (6). pp. 502-516. ISSN 1741-8410 (print); 1741-8429 (online)

Conference or Workshop Item

Siti Rabiatull Aisha, Idris and Ali, Ourdjini and Y. T., Chin (2012) Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper. In: Proceedings of the 35th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 2012), 6-8 November 2012 , Kinta Riverfront Hotel, Ipoh, Perak. pp. 1-3..

This list was generated on Wed Jul 18 09:10:29 2018 +08.